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Welcome Impex Private Limited
Navrangpura, Ahmedabad, Gujarat
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Solder Alloy

Manufacturer of a wide range of products which include cadmium zinc based alloy, lead free solder alloy, lead solder alloy, lead free solder, tin lead zinc based alloy and tin zinc based alloy.

Cadmium Zinc Based Alloy

Cadmium Zinc Based Alloy
  • Cadmium Zinc Based Alloy
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Product Details:

Minimum Order Quantity50 Kilogram
Atomic mass112.411 u
Melting point in celcius321.1
Electron configruation[Kr] 4d105s2
Main Useimmetation of jewllery manufacturing unit
Shear Strength in PSi11,000 to 13,000 (Depending upon the composition)
Elongation2%

Cadmium Zinc Based Alloy they are particularly used in the application where soldering temperatures are higher.

Specifications:
Wipl CodeZincAluminumMelting Temperature(DEG.C)
CZ60404060312
CZ70303070298
CZ821717.582.5265
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Lead Free Solder Alloy

Lead Free Solder Alloy
  • Lead Free Solder Alloy
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Product Details:

ApplicationReflow Soldering, Wave Soldering, Hand Soldering
Weight5-6 kg
Length15 cm
Useswave-soldering, to reduce maintenance cost due to increased tin-scavenging of high-tin solder
Forms Available11
Melting Point in celcius188

Specification:

TypesMel. Point(Deg.C)Sn(Tin)(%)Cu(Copper)(%)Ni(Nickel)(%)Ge(Germanium)(%)Sb(Antimony)(%)Ag(Silver)(%)
Sn100C227Bal0.70.05<=0.01

Cast Alloy217-219Bal0.8

0.52.5
SAC305217-218Bal0.5


3
SAC387217-218Bal0.7


3.8
SAC405217-218Bal0.5


4
Sn96.5/Ag3.5221Bal



3.5
Sn100CE227Bal0.40.05<=0.01

Sn100CLN3231Bal0.40.15


SAC B 0307217Bal0.7


0.3
SAC B 0107227Bal0.7


0.1
Sn99.3/Cu0.7227
Bal0.7



Sn97/Cu03227-300973



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Lead Solder Alloy

Lead Solder Alloy
  • Lead Solder Alloy
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Product Details:

WeightUpto 10 kg
Length15 cm
ApplicationReflow Soldering, Wave Soldering, Hand Soldering

TypesSn(Tin)Sb(Antimony)Bi(Bismuth)Ag(Silver)Pb(Lead)
Battery Alloy


50/5049-510.020.15
Balance


Radiator Alloy
25/7524.5-25.50.020.25
Balance
30/7029.5-30.50.50.25
Balance
35/6539.5-40.50.50.25
Balance
40/6039.5-40.50.50.25
Balance


Electric Alloy
60/4058.5-59.60.050.05
Balance
63/3762.5-63.50.050.05
Balance
62/36/262

236
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Lead Free Solder

Lead Free Solder
  • Lead Free Solder
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Product Details:

Minimum Order Quantity50 Kilogram
ApplicationReflow Soldering, Wave Soldering, Hand Soldering
Weight250-300 gm
Length1-15 cm

Physical Properties of Lead-free Alloys SnAgCu(Bi) Alloys:
  • Higher melt point lead-free alternative. SnAgCu family is electronics industry standard which in most cases has shown equal or greater thermal cycle fatigue resistance than SnPb.
  • Higher surface tension and poorer wetting than SnPb.
  • Ag provides greater strength but less ductility than Pb.
  • Cu reduces the melting point of the solder. Cu improves thermal cycle fatigue resistance. Cu improves wettability. Cu retards the dissolution rate of copper from boards and components into the molten solder during soldering.
  • Bi reduces the melting point of the solder. Bi improves wettability. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.

SnBi58(Ag) Alloy:
  • Low melt point lead-free alternative potentially suitable for some consumer electronics. Low melt point precludes its use for applications where operating temperature is close to 138C.
  • Large Bi proportion greatly reduces the melting point of the solder, but the alloy is more brittle. Bi improves wettability but is somewhat offset by higher oxidation rate. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.
  • A small amount of Ag can improve strength and thermal cycle fatigue resistance, assuming the absence of lead.

SnZn(Bi) Alloy:
  • Moderate melt point lead-free alternative is only slightly higher than SnPb.
  • Zn lowers melting point. Zn exhibits high oxidation rate and is susceptible to atmospheric corrosion. High oxidation rate precludes its use for wave soldering. Stencil life or shelf life of solder paste may be reduced due to reactive nature of zinc.
  • Bi further lowers melting point. Bi improves wettability and slightly improves corrosion resistance. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.

SnInAgBi Alloy:
  • Moderate melt point lead-free alternative is lower than SnAgCu.
  • Ag provides strength.
  • Indium reduces melting point. Indium is a ductile material. In the presence of lead from HASL boards or components indium forms a ternary compound that has a phase change at 114C.
  • Bi further lowers melting point and improves wettability. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.
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Tin Lead Zinc Based Alloy

Tin Lead Zinc Based Alloy
  • Tin Lead Zinc Based Alloy
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Product Details:

Minimum Order Quantity50 Kilogram
Weight35-37 kg
Length15-20 cm
ApplicationReflow Soldering, Wave Soldering, Hand Soldering

TinLead Zinc Based Alloy combines low melting range with good wetting action and corrosion resistance.
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Tin Zinc Based Alloy

Tin Zinc Based Alloy
  • Tin Zinc Based Alloy
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Product Details:

Minimum Order Quantity50 Kilogram
Purity97 % min
Surface FinishPolished
Length15 cm-20 cm

We are one of the prominent names to offer a wide array of Tin Zinc Based Alloy.

Specifications:
Wipl CodeZincAluminumMelting Temperature(DEG.C)
SA9190991199
SA80202080270
SA70303070312
SA60404060341
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Zinc Aluminum Based Alloy

Zinc Aluminum Based Alloy
  • Zinc Aluminum Based Alloy
  • Zinc Aluminum Based Alloy
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Product Details:

Minimum Order Quantity200 Kilogram
ApplicationReflow Soldering,Wave Soldering,Hand
Length15-20 cm
Weight (kg)25-27 kg

Zinc Aluminum Based Alloy develop joints with high strength and are good to corrosion resistance. These alloys are extensively used for cost effective soldering of aluminum heat exchanger return bends such as those in Air condition and refrigerations.

Specifications:
Wipl CodeZincAluminumMelting Temperature(DEG.C)
SA955955382
SA982982403
SA991991412
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Additional Information:

  • Pay Mode Terms: L/C (Letter of Credit),T/T (Bank Transfer),D/P,Other
  • Production Capacity: 150MT
  • Delivery Time: 2-3 Days
  • Packaging Details: 50 Kgs bags
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Solder Alloy

Solder Alloy
  • Solder Alloy
  • Solder Alloy
  • Solder Alloy
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Product Details:

Minimum Order Quantity50 Kilogram
ApplicationReflow Soldering, Wave Soldering, Hand Soldering
Weight250-300 gm
Length1-10 cm

Solder Alloy is a fusible metal alloy used to create a permanent bond between metal work pieces. Solder is typically used in electronics, plumbing, and metal sheet works whereas it can be used for manual soldering with the help of soldering iron or soldering gun.

Specifications:
CompositionTinLeadAntimonyBismuthSilverCopper
Sn3029.5-31.5Balance1.4-1.80.250.0150.08
Sn2019.5-21.8Balance0.8-1.20.250.0150.08
Sn109.0-11.0Balance0.20.031.7-2.40.08
Sn54.5-5.5Balance0.50.250.0150.08
Sn3534.5-36.5Balance1.6-2.00.250.0150.08
Sn4039.5-41.5Balance0.2-0.50.250.0150.08
Sn5049.5-51.5Balance0.2-0.50.250.0150.08
Sn6059.5-61.5Balance0.2-0.50.250.0150.08
Sn6261.5-62.5Balance0.2-0.50.251.75-2.250.08
Sn6362.5-63.5Balance0.2-0.50.250.0150.08
Sn7069.5-71.5Balance0.2-0.50.250.0150.08
Sn96Balance0.1--3.6-4.40.08
Pb80Balance78.5-80.50.2-0.50.250.0150.08
Pb70Balance68.5-70.50.2-0.50.250.0150.08
Pb65Balance63.5-65.50.2-0.50.250.0150.08
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Additional Information:

  • Production Capacity: 250MT
  • Delivery Time: 2-3 Days
  • Packaging Details: 50Kgs bags packing
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Bhavin Jain (Director)
A/314, Atma House
Navrangpura, Ahmedabad- 380009, Gujarat, India



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