Solder Alloy

Manufacturer of a wide range of products which include solder alloy, lead free solder alloy, lead solder alloy, lead free solder, tin lead zinc based alloy and tin zinc based alloy.

Solder Alloy

Ask For Price

Product Price :Get Latest Price

Product Details:

Minimum Order Quantity	50 Kilogram
Application	Reflow Soldering, Wave Soldering, Hand Soldering
Weight	250-300 gm
Length	1-10 cm

Solder Alloy is a fusible metal alloy used to create a permanent bond between metal work pieces. Solder is typically used in electronics, plumbing, and metal sheet works whereas it can be used for manual soldering with the help of soldering iron or soldering gun.

Specifications:

Composition	Tin	Lead	Antimony	Bismuth	Silver	Copper
Sn30	29.5-31.5	Balance	1.4-1.8	0.25	0.015	0.08
Sn20	19.5-21.8	Balance	0.8-1.2	0.25	0.015	0.08
Sn10	9.0-11.0	Balance	0.2	0.03	1.7-2.4	0.08
Sn5	4.5-5.5	Balance	0.5	0.25	0.015	0.08
Sn35	34.5-36.5	Balance	1.6-2.0	0.25	0.015	0.08
Sn40	39.5-41.5	Balance	0.2-0.5	0.25	0.015	0.08
Sn50	49.5-51.5	Balance	0.2-0.5	0.25	0.015	0.08
Sn60	59.5-61.5	Balance	0.2-0.5	0.25	0.015	0.08
Sn62	61.5-62.5	Balance	0.2-0.5	0.25	1.75-2.25	0.08
Sn63	62.5-63.5	Balance	0.2-0.5	0.25	0.015	0.08
Sn70	69.5-71.5	Balance	0.2-0.5	0.25	0.015	0.08
Sn96	Balance	0.1	-	-	3.6-4.4	0.08
Pb80	Balance	78.5-80.5	0.2-0.5	0.25	0.015	0.08
Pb70	Balance	68.5-70.5	0.2-0.5	0.25	0.015	0.08
Pb65	Balance	63.5-65.5	0.2-0.5	0.25	0.015	0.08

Request
Callback

Additional Information:

Production Capacity: 250MT
Delivery Time: 2-3 Days
Packaging Details: 50Kgs bags packing

Yes! I am Interested

Lead Free Solder Alloy

Ask For Price

Product Price :Get Latest Price

Product Brochure

Product Details:

Application	Reflow Soldering, Wave Soldering, Hand Soldering
Weight	5-6 kg
Length	15 cm
Uses	wave-soldering, to reduce maintenance cost due to increased tin-scavenging of high-tin solder
Forms Available	11
Melting Point in celcius	188

Specification:

Types	Mel. Point(Deg.C)	Sn(Tin)(%)	Cu(Copper)(%)	Ni(Nickel)(%)	Ge(Germanium)(%)	Sb(Antimony)(%)	Ag(Silver)(%)
Sn100C	227	Bal	0.7	0.05	<=0.01
Cast Alloy	217-219	Bal	0.8			0.5	2.5
SAC305	217-218	Bal	0.5				3
SAC387	217-218	Bal	0.7				3.8
SAC405	217-218	Bal	0.5				4
Sn96.5/Ag3.5	221	Bal					3.5
Sn100CE	227	Bal	0.4	0.05	<=0.01
Sn100CLN3	231	Bal	0.4	0.15
SAC B 0307	217	Bal	0.7				0.3
SAC B 0107	227	Bal	0.7				0.1
Sn99.3/Cu0.7227		Bal	0.7
Sn97/Cu03	227-300	97	3

Request
Callback

Yes! I am Interested

Lead Solder Alloy

Ask For Price

Product Price :Get Latest Price

Product Details:

Application	Reflow Soldering, Wave Soldering, Hand Soldering
Weight	Upto 10 kg
Length	15 cm

Types	Sn(Tin)	Sb(Antimony)	Bi(Bismuth)	Ag(Silver)	Pb(Lead)
Battery Alloy
50/50	49-51	0.02	0.15		Balance
Radiator Alloy
25/75	24.5-25.5	0.02	0.25		Balance
30/70	29.5-30.5	0.5	0.25		Balance
35/65	39.5-40.5	0.5	0.25		Balance
40/60	39.5-40.5	0.5	0.25		Balance
Electric Alloy
60/40	58.5-59.6	0.05	0.05		Balance
63/37	62.5-63.5	0.05	0.05		Balance
62/36/2	62			2	36

Request
Callback

Yes! I am Interested

Lead Free Solder

Ask For Price

Product Price :Get Latest Price

Product Details:

Minimum Order Quantity	50 Kilogram
Application	Reflow Soldering, Wave Soldering, Hand Soldering
Weight	250-300 gm
Length	1-15 cm

Physical Properties of Lead-free Alloys SnAgCu(Bi) Alloys:

Higher melt point lead-free alternative. SnAgCu family is electronics industry standard which in most cases has shown equal or greater thermal cycle fatigue resistance than SnPb.
Higher surface tension and poorer wetting than SnPb.
Ag provides greater strength but less ductility than Pb.
Cu reduces the melting point of the solder. Cu improves thermal cycle fatigue resistance. Cu improves wettability. Cu retards the dissolution rate of copper from boards and components into the molten solder during soldering.
Bi reduces the melting point of the solder. Bi improves wettability. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.

SnBi58(Ag) Alloy:

Low melt point lead-free alternative potentially suitable for some consumer electronics. Low melt point precludes its use for applications where operating temperature is close to 138C.
Large Bi proportion greatly reduces the melting point of the solder, but the alloy is more brittle. Bi improves wettability but is somewhat offset by higher oxidation rate. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.
A small amount of Ag can improve strength and thermal cycle fatigue resistance, assuming the absence of lead.

SnZn(Bi) Alloy:

Moderate melt point lead-free alternative is only slightly higher than SnPb.
Zn lowers melting point. Zn exhibits high oxidation rate and is susceptible to atmospheric corrosion. High oxidation rate precludes its use for wave soldering. Stencil life or shelf life of solder paste may be reduced due to reactive nature of zinc.
Bi further lowers melting point. Bi improves wettability and slightly improves corrosion resistance. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.

SnInAgBi Alloy:

Moderate melt point lead-free alternative is lower than SnAgCu.
Ag provides strength.
Indium reduces melting point. Indium is a ductile material. In the presence of lead from HASL boards or components indium forms a ternary compound that has a phase change at 114C.
Bi further lowers melting point and improves wettability. In the presence of lead from HASL boards or components Bi can greatly reduce thermal cycle fatigue resistance due to the formation of Sn16Pb32Bi52 (MP=95C) which can diffuse along the grain boundaries.

Request
Callback

Yes! I am Interested

Tin Lead Zinc Based Alloy

Ask For Price

Product Price :Get Latest Price

Product Details:

Minimum Order Quantity	50 Kilogram
Application	Reflow Soldering, Wave Soldering, Hand Soldering
Weight	35-37 kg
Length	15-20 cm

TinLead Zinc Based Alloy combines low melting range with good wetting action and corrosion resistance.

Request
Callback

Yes! I am Interested

Tin Zinc Based Alloy

Ask For Price

Product Price :Get Latest Price

Product Details:

Minimum Order Quantity	50 Kilogram
Purity	97 % min
Surface Finish	Polished
Length	15 cm-20 cm

We are one of the prominent names to offer a wide array of Tin Zinc Based Alloy.

Specifications:

Wipl Code	Zinc	Aluminum	Melting Temperature(DEG.C)
SA9190	9	91	199
SA8020	20	80	270
SA7030	30	70	312
SA6040	40	60	341

Request
Callback

Yes! I am Interested

Zinc Aluminum Based Alloy

Ask For Price

Product Price :Get Latest Price

Product Details:

Minimum Order Quantity	200 Kilogram
Weight (kg)	25-27 kg
Application	Reflow Soldering,Wave Soldering,Hand
Length	15-20 cm

Zinc Aluminum Based Alloy develop joints with high strength and are good to corrosion resistance. These alloys are extensively used for cost effective soldering of aluminum heat exchanger return bends such as those in Air condition and refrigerations.

Specifications:

Wipl Code	Zinc	Aluminum	Melting Temperature(DEG.C)
SA955	95	5	382
SA982	98	2	403
SA991	99	1	412

Request
Callback

Additional Information:

Pay Mode Terms: L/C (Letter of Credit),T/T (Bank Transfer),D/P,Other
Production Capacity: 150MT
Delivery Time: 2-3 Days
Packaging Details: 50 Kgs bags

Yes! I am Interested

Solder Alloy

Solder Alloy

Lead Free Solder Alloy

Lead Solder Alloy

Lead Free Solder

Tin Lead Zinc Based Alloy

Tin Zinc Based Alloy

Zinc Aluminum Based Alloy

Explore More Products